Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Kioxia says it has developed highly stackable oxide-semiconductor channel transistors capable of supporting high-density 3D ...

Belgian research lab Imec has revealed 3D stacked memory-on-GPU AI processor thermal data at IEDM (IEEE International Electron Devices Meeting) this week. The data comes from a thermal STCO ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a ...

At Intel's big Innovation 2023 event, CEO Pat Gelsinger confirmed that the company would adopt a 3D Cache approach for CPUs in the future - though it won't be a part of the upcoming Meteor Lake ...

512GB DRAM sounds huge, but don’t hold your breath for consumer availability NEO’s 3D X-DRAM stacks layers sky-high, but price and practicality remain unclear AI and enterprise systems will get the ...

NEC Electronics with Elpida Memory and Oki Electric, has developed technology to allow cell phones and portable devices to have as much memory as a high-performance computer. Single Package Can House ...

For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...