Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Heterogeneous integration refers to the assembly of disparate semiconductor components—such as logic, memory and analogue dies—into a unified package, leveraging advanced interconnect and ...

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Skymizer, an AI inference infrastructure company and creator of the HyperThought™ LPU platform, today announced a strategic collaboration with VIA NEXT Technologies, a leading provider of system-level ...

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a ...