– adapted to various socket locking systems: Twist lock, Knob lock, ZIF lock, Quicklock sockets – low profile solution: the adapter mounted together with the E-tec twist lock socket will only have a ...

Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...

For validating BGA and LGA devices with a 0.65-mm pitch, the company's latest hybrid socket adapter design deploys both male and female pins in an interstitial pattern. Its design provides the ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

Yesterday, a report emerged claiming that Intel is planning to release its upcoming 14-nanometer Broadwell architecture processors as a ball grid array (BGA) rather than an land grid array (LGA) ...

Complying with the Restriction of Hazardous Substances directive and other worldwide initiatives for lead-free manufacturing, the company now offers lead-free solder ball terminal options on select ...

Intel’s BGA processors are definitely going to become a bigger part of Intel’s portfolio in the future and by the looks of things these BGA packages are mainly designed to transform the bottom segment ...

Intel is rumoured to be considering releasing its Broadwell processors in a single package type using a ball-grid array (BGA) layout - potentially putting an end to the days of user-replaceable ...

Commenting on Intel's reported plans of abandoning CPU socket designs and changing to directly soldered CPUs after two years, Asustek Computer vice president and general manager of motherboard/desktop ...

AMD's statement that it will continue to support the enthusiast market with socket-friendly processor packaging appears to have tipped Intel's hand, with the chip giant finally breaking silence on the ...