Through-hole assembly means bending leads on components and putting the leads through holes in the circuit board, then soldering them in place, and trimming the wires. That took up too much space and ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

The printed circuit board design best practices series of articles discusses the different steps of PCB development from the basics of creating a design schematic with specific requirements, to ...

When an electronic component is being inspected by an acoustic microscope, ultrasound is pulsed into the part by the scanning transducer. At any material interface within the part, a portion of the ...