Aries Electronics has expanded its line of CSP (chip scale package) and MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad to include a version that ...

For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now ...

Users of the SG-BGA-6099 are said to be able to socket their 1-mm pitch, 829-ball BGA and CSP devices without any performance losses. As an example, the socket will support the AMD 16-038 chip with an ...

The 776 series of chip-scale package (CSP) sockets employ patent-pending retention arm technology, which relies on a vertical contact load methodology and a proprietary latching mechanism that holds ...

SAN JOSE, CA, March 14, 2019 /PRNewswire/ -- On March 14th at the OCP Global Summit, Inspur, a leading global data center infrastructure provider, and Intel, a leader in the semiconductor industry, ...

SAN JOSE, Calif., March 15, 2019 — On March 14th at the OCP Global Summit, Inspur, a leading global data center infrastructure provider, and Intel, a leader in the semiconductor industry, jointly ...