SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave ...
TOKYO — Kyocera Corp. today announced development of a low-resistance alumina-based technology from multi-layer chip packages that combines the advantages of low-temperature co-fired ceramics (LTCC) ...
KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (NYSE:KYO)(TOKYO:6971) announced today that it will construct a new manufacturing plant on the premises of its Kagoshima Sendai manufacturing complex ...
The SMRS-A2/B2 Series ceramic resonators are available in 2.0 x 2.5 x 1.2-mm SMT packages. While the two-terminal A2 does not feature internal capacitance, the three-terminal B2 offers a built-in ...
Torex Semiconductor Ltd. has developed USP (Ultra Small Package) power management ICs aimed at battery powered and energy efficient applications. The packages use electroformed leads rather than lead ...
The manufacturing process and die get most of the attention, but the packaging plays an important part in enabling and limiting performance, manufacturability, particularly when it comes to ...
Modern semiconductors facilitate faster switching speeds and lower losses to support designers. A new leadless power package drives down on-state resistance and provides close to “GaN-like” switching ...
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