New 3D-printed copper technology offers a high-efficiency solution to the data center power crisis.

The MarketWatch News Department was not involved in the creation of this content. Boyd's Liquid Cold Plates Continue to Deliver Next-Level Cooling to New Generation AI Processors in Hyperscaler, ...

Square-Foot Lancaster, PA., Facility Enables High-Volume Production of Single- and Two-Phase Cold Plates for AI and High-Density Computing LANCASTER, Pa., May 19, 2026 /PRNewswire/ -- ACT, Advanced ...

Data centers require massive amounts of energy for cooling, but these copper cooling plates are optimally designed to reduce ...

Researchers from University of Illinois at Urbana-Champaign and Fabric8Labs have published findings on a topology-optimised ...

Mechanical engineers have designed a more effective and energy-efficient technology for cooling computer chips. Published in ...

Data center rack density has risen rapidly in recent years. Operators are cramming more computing power into each server rack to meet the needs of AI and other high-performance computing applications.

SAXONBURG, Pa., March 05, 2026 (GLOBE NEWSWIRE) -- Coherent Corp. (COHR), a global leader in photonics, today announced the launch of Thermadite™ 800 Liquid Cold Plates (LCP) for next-generation AI ...

In 2025, data centers consumed 485 TWh of electricity. Thirty percent of that, more than the entire annual power consumption ...

Researchers at University of Illinois Urbana-Champaign have developed a new cooling technology that could make data centers ...

http://www.lytron.comAs electronic manufacturers strive to design and build higher-power electronic components and subsystems, they continue the move toward more ...