AI agents capable of handling large portions of chip design and verification are less about convenience and more about ...
Cadence has now launched the ChipStack AI Super Agent, the world’s first agentic workflow for automating chip design and ...
Mike Ellow, CEO of Siemens EDA, outlines the company’s ambitions for AI-powered digital twins that recreate every part of a ...
OpenAI is poised to enter the custom component business in 2025. The brand is currently in talks with Taiwan Semiconductor Manufacturing Co. (TSMC) to fabricate the first generation of its in-house AI ...
The company said Cadence ChipStack AI Super Agent will help revolutionize how engineers automate chip design by improving ...
Next-generation wireless speeds leap dramatically with analog chip design, transforming how data can move in homes and data centers ...
Open-source tools and multi-project wafer (MPW) shuttles democratize chip design for low cost. Small circuits, both analog and digital, are accommodated by embedding them as “tiles” or “clusters” into ...
Cadence is a leader in EDA and is increasingly focused on digital and AI applications and implementations. Excellent design, simulation, and verification functionality, locked-in customers, and ...
Experts At The Table: AI is starting to impact several parts of the EDA design and verification flows, but so far these improvements are isolated to a single tool or small flows provided by a single ...
Quantum computing has long promised breakthroughs in chemistry, logistics, finance, and climate modeling, but the hardware has struggled to scale beyond fragile lab prototypes. A new generation of ...
OpenAI is reportedly getting closer to producing its own in-house artificial intelligence chip as it seeks to gain leverage over existing manufacturers and continues to expand its data centers.
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...