SK Hynix suddenly finds itself in the midst of damage control (both literally and figuratively) over a batch of defective DRAM products that shipped out to customers. In a statement on the matter, the ...

Semiconductor wafer defect pattern recognition and classification is a crucial area of research that underpins yield enhancement and quality assurance in microelectronics manufacturing. The discipline ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...