Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

Chief among these is surface contamination introduced by standard handling techniques, which often rely on polymer-based supports to transfer or stack layers. Even ...

Samsung has come out of the gate strong in 2024 by announcing it's developed a 12-layer version of the most cutting-edge high-bandwidth memory (HBM) available today, HBM3e. The development will move ...

Successive versions of vertical transistors are emerging as the likely successor to finFETs, combining lower leakage with significant area reduction. A stacked nanosheet transistor, introduced at N3, ...

The six stacks of semiconductors for hybrid complementary metal-oxide semiconductor (CMOS) microchips advances miniaturization and topples the previous record of two stack King Abdullah University of ...

Cambridge, MA – MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Most organizations are now well into re-platforming their enterprise data ...

The artificial intelligence revolution is reshaping the technology landscape, creating both tremendous value and significant challenges across the entire AI business stack. It's important to identify ...