SAN JOSE — Fujitsu Microelectronics America Inc. today said it was offering the industry's first four-stacked multi-chip package, which is designed to hold a pair of 64-megabit NOR-based flash memory ...
GaN technology achieves high output power of 2.5kW in power supply units for servers; demonstration set for Embedded Technology 2012 Nov. 14-16 in Yokohama, Japan The use of GaN technology in power ...
Fujitsu develops six chip packageNews from E-InSiteFujitsu has introduced a multichip package (MCP) for mobile phones that stacks three flash, one SRAM, and two fast cycle RAM (FCRAM) devices.The ...
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