Exclusive-Besi fields takeover interest on surging demand for advanced chip packaging, sources say

By Milana Vinn and Amy-Jo Crowley NEW YORK/LONDON, March 13 (Reuters) - BE Semiconductor Industries has attracted takeover interest as its chip-packaging technology becomes increasingly strategic for ...
EurekAlert!

CityUHK pioneers breakthrough in 3DIC semiconductor packaging materials

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...
Bloomberg L.P.

Technology and policy shifts reshape chip packaging

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...
Bloomberg L.P.

Advanced Semiconductor Packaging Market Could Reach $80 Billion by 2033 as AI Chips Spread to Consumer Devices, According to Bloomberg Intelligence

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...