“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

The global Fully Automatic Semiconductor Molding System market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, growing at a CAGR of % during the forecast period. The ...

A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

(Nanowerk News) Kazuma Kurihara and Hideki Takagi, Large Scale Integration Team, the Research Center for Ubiquitous MEMS and Micro Engineering of the National Institute of Advanced Industrial Science ...