The issue of MEMS-based system solutions and their packaging will be addressed at the MEMS Industry Group’s annual MEMS Executive Congress, which will be held in Scottsdale AZ on November 3-5, 2010, ...
Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
When it comes to making though-silicon vias, there are no clear lines of delineation about the roles of design houses, fab facilities, and packaging houses. Yet all of these entities face a host of ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback