Interesting Engineering on MSN
SK hynix builds innovative cooling solution inside a 3D stacked memory chip
SK hynix has launched iHBM, an architecture featuring a Dynamic Random Access Memory (DRAM) ...
SK hynix HBM cooling takes a new form: the South Korean chipmaker embeds silicon-based elements directly inside the HBM ...
SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...
The OWC Stack AI promises to make local processing of large LLMs easier by somehow inflating your Mac's GPU memory across ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...
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