Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal ...
SemiQ Inc, a developer of SiC solutions, will debut its latest SiC module advances at the 2026 Applied Power Electronics Conference (APEC) from March 22nd to 26th, at the Henry Gonzalez Convention ...
Manufacturers of silicon carbide (SiC) and gallium nitride (GaN) power ICs leveraged the APEC 2024 conference to highlight their latest developments in wide-bandgap semiconductors. These devices offer ...
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