One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Chipmakers Conduct True Production-Level Kelvin Testing of QFN Packages That Power Latest Consumer Devices With New Socket From Semiconductor Test Supplier Antares Advanced Test Technologies largest ...
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