BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
This article discusses Plastic Quad Flat Pack No-lead (PQFN) and Quad Flat Pack No-Lead Exposed Pad (QFN-EP) packages, as well as, wettable flank plating, board solder, and visual examination of ...
UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and ...
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