Why non-destructive SAM is an efficient tool for analysis of adhesion between layers and presence of possible flaws in each layer. Scanning acoustic microscopy, or SAM, is a non-destructive technique ...
Failure analysts often use scanning acoustic microscopes to image flip-chip features such as underfill voids, delaminations, and disbonded solder bumps. As designers have decreased the size of IC ...
Unlike the light microscopes that use visible light to illuminate the sample, LSCM instead utilizes a focused scanning laser to illuminate a subsurface of a three-dimensional (3D) specimen. The visual ...
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