The semiconductor industry continually pushes the boundaries of device performance through advanced process modelling and epitaxial growth techniques. In this context, sophisticated simulation methods ...

WILMINGTON, Mass.--(BUSINESS WIRE)-- Onto Innovation Inc. (ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di ™ technology on the Dragonfly ...

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

Wafer level integration encompasses fan-in, core fan-out, high-density fan-out, 2.5D IC, and 3D IC packaging technologies. However, only those with a bumping pitch size of less than 100 µm are ...

Compatible with semiconductor fabrication and processing technologies, thermoelectric thin-film materials allow the cooling function to be integrated within power-semiconductor devices. Dr. Paul A.