A new technical paper titled “Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review” was published by researchers at KU Leuven and imec.
In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is ...
Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...
A study published in Molecules and led by researchers from the Changchun Institute of Optics, Fine Mechanics and Physics (CIOMP) of the Chinese Academy of Sciences demonstrated how deep learning can ...
Researchers have tested eight stand-alone deep learning methods for PV cell fault detection and have found that their accuracy was as high as 73%. All methods were trained and tested on the ELPV ...
The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...
As semiconductor chip technology advances towards nanometre and sub-nanometre scales, the demands becomes exponentially more ...
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