TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

Samsung Electro-Mechanics announced on the 4th that it will unveil its next-generation semiconductor substrate technology at the 'International PCB and Semiconductor Packaging Industry Exhibition ...

TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to ...

[Asia Economy Reporter Suyeon Woo] As the semiconductor industry experiences a boom, supply shortages have extended to the raw material package substrates, rapidly improving the profitability of ...

In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

LG Innotek seeks to grow its semiconductor parts business to produce an annual revenue of over 2.2 billion dollars by 2030. SEOUL, South Korea, July 3, 2025 /PRNewswire/ -- LG Innotek is continuing ...

Samsung Electro-Mechanics and LG Innotek announced on the 3rd that they will participate in the 'International PCB and Semiconductor Packaging Exhibition' (KPCA Show 2025), held at Songdo Convensia in ...

Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon ...

Suppliers of IC packaging materials including leadframes and substrates are poised to raise their prices in the second quarter to reflect rising raw materials costs, despite a slight slip in capacity ...