The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Solid state image sensors require protection from the ambient atmosphere. First-generation imagers were housed in standard semiconductor packages with glass lids. These were hermetic and delivered ...

Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...