The German tooling firm announces the development of a new texturing process for multicrystalline wafers using diamond wire sawing on its LINEX inline system. Company believes process can boost multi ...
Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...
The complete wafer saw solution includes: DISCO’s fully automatic dicing saw for high-throughput, dual-cut processing, DISCO’s ablation laser saw and stealth dicing saw, Rudolph’s NSX ® inspection ...
Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...
Researchers at the Solar Energy Research Institute of Singapore (SERIS) at the National University of Singapore (NUS) have announced the development of a significantly low-cost technique to texture ...
A trio of companies is attempting to reduce the waste caused by wafer-sawing processes by growing crystalline silicon on relatively cheap foil. NREL has teamed up with DOE's Oak Ridge National ...
The elimination of sawing kerf loss combined with its ability to make thinner wafers of high quality make the implant-cleave wafering approach technically and economically attractive. For example, ...
University of Utah engineers have a devised a less wasteful way to slice wafers of germanium for solar power cells. Currently, germanium is restricted to high-end dual or triple junction solar cells, ...
German researchers have devised a method to eliminate wasteful and energy-consuming steps for the production of crystalline silicon for solar cells. A new process for purifying silicon and making it ...
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