Leading semiconductor makers team up with advanced packaging provider to jointly develop next-generation of eWLB wafer-level packaging technology Geneva, Singapore and Neubiberg, Germany, August ...
Advanced Chip Engineering (ACE), engaged in development of wafer-level packaging technology, noted that its 6-inch products will enter mass production this October. Since last November, it has broken ...
Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco ...
Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...
Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.
SkyWater is the first domestic provider of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies to support the reshoring of the semiconductor supply chain KISSIMMEE, Fla.--(BUSINESS WIRE)-- ...
Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...
The research team led by Distinguished Research Fellow Dr. Jun-Yeob Song at the Semiconductor Manufacturing Research Center, KIMM, is holding a large rectangular panel developed in collaboration with ...
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