Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Engineers from Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of Technology worked with ...

Belgian research lab Imec has revealed 3D stacked memory-on-GPU AI processor thermal data at IEDM (IEEE International Electron Devices Meeting) this week. The data comes from a thermal STCO ...

Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

The number of AI inference chip startups in the world is gross – literally gross, as in a dozen dozens. But there is only one ...

Team led by IIT Kharagpur graduates, Subhasish Mitra and Tathagata Srimani delivers first monolithic 3D chip built in a U.S.

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

Engineers at Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of ...

Kioxia says it has developed highly stackable oxide-semiconductor channel transistors capable of supporting high-density 3D ...