Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Engineers from Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of Technology worked with ...

The number of AI inference chip startups in the world is gross – literally gross, as in a dozen dozens. But there is only one ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Team led by IIT Kharagpur graduates, Subhasish Mitra and Tathagata Srimani delivers first monolithic 3D chip built in a U.S.

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

During a visit to one of the manufacturing lines, Linus explores how Kioxia turns individual memory dies into finished flash ...

Kioxia says it has developed highly stackable oxide-semiconductor channel transistors capable of supporting high-density 3D ...

To prevent jitter between frames, Kuta explains that D-ID uses cross-frame attention and motion-latent smoothing, techniques that maintain expression continuity across time. Developers can even ...

Engineers at Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of ...

CMU, Stanford, Penn, MIT, and SkyWater Technology achieved a milestone with the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed ...