IEEE

Microbump Interconnections Using Vertical Wire Technology for the Power Connections Between SoC and Substrate in the Bridge Die-Based Packaging Platform

Abstract: In this study, vertical wire technology was employed to provide a power-line connection between a system-on-chip (SoC) and a substrate. Metallurgical bonding was performed between the ...
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Playing Minecraft crystal PvP using only the scroll wheel

This video features a Minecraft player attempting to compete in Crystal PvP while restricted to using only a mouse scroll wheel for item selection. The challenge involves unbinding all traditional ...
IEEE

Combining Wenner-Schlumberger and Vertical Electrical Sounding (VES) for Landslide Mitigation in Tieng Village, Kejajar, Central Java

Abstract: Tieng Village in Kejajar District, Wonosobo Regency, Central Java, is highly prone to landslides due to its steep topography, high rainfall, and complex volcanic geology. This study aims to ...